Panasonic RZ-S50W (Japan) Bluetooth Headphones Teardown

ID: 135885

Description: A look inside the Panasonic RZ-S50W (Japan) /...

Steps:

1. Features:
2. Exceptional Sound and Noise Cancellation. Multiple MEMS microphones
3. Optimum Sound Isolation
4. Strong, Stable Connection
5. High-Quality Calling Sound
6. Approximately, 6 hours playback, and up to 20 Hours of use with charger
7. Bluetooth® 5.0
8. Capacitive touch sensor control

9. What is in the box
10. Headphones / Charging Case
11. USB 'C' Cable
12. Headphone rubber tips for different sizes of ears
13. User's Manual

14. Charging case with headphones
15. Close up view of headphones

16. Side views of Headphone
17. MEMS Microphones
18. Speaker Spatial Vent Port
19. Speaker Sound Port
20. Speaker Vent
21. USB Interface
22. Charger Interface
23. Vent Port

24. View of Headphone with rubber ear piece [cap] removed
25. Vent Port

26. Since the Panasonic Headphone enclosure is glued together, the only way in was to cut into the headphone.
27. This is a destructive teardown
28. A Razsor Knife was use to cut into the Panasonic headphone along the seam in the headphone. Then a Jimmy Tool was used to open up the headphone
29. Once opened, we get our first look at the inside of the headphone

30. Opening up the headphone, we can see the main PCB, Battery, Speaker, etc. Tweezers and a Pick Tool were used to removed the electronics from the enclosure
31. Double sided foam tape was used to hold the main the PCB to the Battery and to the Touch Sensor / Antenna PCB. This foam tape had to be cut free. Then Denatured Alcohol was used to remove the foam tape glue from the PCBs and Battery
32. Battery
33. Main PCB
34. Speaker Area
35. Touch Sensor and Antenna
36. Double Sided Foam Tape

37. At first, I wasn't sure about the solder balls. Then I realized they are used to anchor the USB and Power Interface pins on the outside of the Headphone to the internal circuit board.
38. I had to used a soldering iron to remove the solder balls, so that the internal interface circuit board could be removed. I had to also remove solder from the speaker wires to free up the internal circuit board.
39. The internal circuit board was also attached a MEMS Microphone that appeared to be monitoring the Speaker Chamber of the Headphone, since it was faced in. I had to remove the outside panel with 'R' on it with a Razor Knife to free the MEMS Microphone. Once the MEMS Microphone was freed, the interface circuit board could be pulled out
40. USB and Power (Charger) Interface
41. MEMS Microphone
42. Sound Ports
43. Speaker Wires
44. Internal Circuit Board that interface Power and USB to the Headphones

45. There was not much to see on the internal interface board. The was one IC component that could not be crossed. If you happen to know the component, please leave a comment below
46. Unknown Component

47. Full Sensor Flex/Charging PCB IC Identification:
48. You may need to enlarge the picture to view the text.

49. Next the Speaker sound chamber cover was removed with the use of a Pick Tool and Tweezers. A Razor Knife was used to cut the glue holding the speak in place
50. The speaker had no identifiable markings
51. With Speaker removed, we can see the sound chamber and sound ports

52. Closeup view of the Battery
53. Li-Ion 3.7V, 0.32Wh
54. The battery appears to be from VDL Electronics Co., Shenzhen, China

55. Closeup view of the Antenna/Touch Sensor side of the Main PCB
56. DSP Group - C2A1A Hybrid Active Noise Cancellation (ANC) Codec and Audio Digital Signal Processor (DSP)
57. 651DF1M9 - Could not cross part number, but during a web search found out that it may be an integrated battery management IC
58. W25Q32JWUUIMTR- SPI FLASH 32Mb
59. MEMS Microphone Port

60. Closeup view of some of the components on the Antenna/Touch Sensor side of the Main PCB
61. DSP Group - C2A1A Hybrid Active Noise Cancellation (ANC) Codec and Audio Digital Signal Processor (DSP)
62. W25Q32JWUUIMTR- SPI FLASH 32Mb
63. 651DF1M9 - Could not cross part number, but during a web search found out that it may be an integrated battery management IC

64. Battery side close up view of the Main PCB
65. AIROHA AB1552 - ARM Cortex M4/Bluetooth 5.0 Dual Mode
66. 927 MPS1 MEMS Microphone. The Headphone uses three MEMS microphones with this part number
67. Could not cross the part number. If you know the part, please leave a comment below. The 2D bar code on the part reads as STM927352NH2S011
68. Crystal Oscillator
69. Unknown component. Labelled B2A. Please leave a comment if you happen to know this component
70. Unknown component. Labelled SV4CP 240. Please leave a comment if you happen to know this component. Separated from PCB during teardown

71. Closeup view of some of the components on the Battery side of the Main PCB
72. AIROHA AB1552 - ARM Cortex M4/Bluetooth 5.0 Dual Mode
73. 927 MPS1 MEMS Microphone. The Headphone uses three of these MEMS microphones
74. Could not cross the part number. If you know the part, please leave a comment below. The 2D bar code on the part reads as STM927352NH2S011
75. Unknown component. Labelled B2A. Please leave a comment if you happen to know this componentNew line.

76. Closeup view of top and bottom side of the Touch Sensor Flex PCB and PCB Antenna

77. Full Main PCB IC Identification:
78. You may need to enlarge the picture to view the text.

79. Predicted Block Diagram of the Panasonic RZ-S50W Bluetooth Headphones:
80. You may need to enlarge the picture to view the text.

81. Teardown Exploded View of the Panasonic Headphone