VIA GO Teardown

ID: 181512

Description: Explore internals of the device: layout,...

Steps:

1. USB and audio ports at front and rest of I/O are at the back. power button is on top.

2. Remove four (phillips) screws on the bottom of the device, these are located inside of rubber feet.

3. remove screws that hold motherboard in the case.
4. LPDDR3 slot (there is no internal memory).
5. M.2 slot with Intel 3160NGW (Dual-band AC-WiFi + BT)
6. 20-pin connector for external SATA hard drive.

7. screws to remove fan assembly
8. screws to remove heatsink
9. RTC battery
10. eMMC (SD) chip
11. power button

12. closeup of Intel N3010 SoC and eMMC chip.

13. component overview. also closeup of 20-pin external sata connector.